Rectifier diode Chip

Tlhaloso e Khutšoanyane:

Tloaelo:

Chip e 'ngoe le e' ngoe e lekoa ho TJM , ho hlahloba ka tšohanyetso ho thibetsoe ka thata.

Ho lumellana ho hotle ha li-parameter tsa chips

 

Likaroloana:

Ho theoha ha motlakase ho ea pele

Ho hanyetsa mokhathala o matla oa mocheso

Botenya ba cathode aluminium layer bo ka holimo ho 10µm

Tšireletso ea mekhahlelo e habeli ho mesa


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Rectifier Diode Chip

Rectifier diode chip e entsoeng ke RUNAU Electronics e ile ea hlahisoa qalong ke maemo a ts'ebetso ea GE le theknoloji e tsamaellanang le maemo a ts'ebeliso ea USA mme a tšoaneleha ke bareki ba lefats'e ka bophara.E hlahisoa ka litšoaneleho tse matla tsa ho hanyetsa mokhathala oa mocheso, bophelo ba nako e telele ea tšebeletso, motlakase o phahameng, hona joale o moholo, ho ikamahanya le maemo a matla a tikoloho, joalo-joalo Chip e 'ngoe le e' ngoe e lekoa ho TJM, tlhahlobo e sa reroang ha e lumelloe ka tieo.Khetho e sa fetoheng ea li-parameter tsa chips e fumaneha hore e fanoe ho latela tlhokahalo ea kopo.

Paramethara:

Diameter
mm
Botenya
mm
Palo ea li-volts
V
Cathode Out Dia.
mm
Tjm
17 1.5±0.1 ≤2600 12.5 150
23.3 1.95±0.1 ≤2600 18.5 150
23.3 2.15±0.1 4200-5500 16.5 150
24 1.5±0.1 ≤2600 18.5 150
25.4 1.4-1.7 ≤3500 19.5 150
29.72 1.95±0.1 ≤2600 25 150
29.72 1.9-2.3 2800-5500 23 150
32 1.9±0.1 ≤2200 27.5 150
32 2±0.1 2400-2600 26.3 150
35 1.8-2.1 ≤3500 29 150
35 2.2±0.1 3600-5000 27.5 150
36 2.1±0.1 ≤2200 31 150
38.1 1.9±0.1 ≤2200 34 150
40 1.9-2.2 ≤3500 33.5 150
40 2.2-2.5 3600-6500 31.5 150
45 2.3±0.1 ≤3000 39.5 150
45 2.5±0.1 3600-4500 37.5 150
50.8 2.4-2.7 ≤4000 43.5 150
50.8 2.8±0.1 4200-5000 41.5 150
55 2.4-2.8 ≤4500 47.7 150
55 2.8-3.1 5200-6500 44.5 150
63.5 2.6-3.0 ≤4500 56.5 150
63.5 3.0-3.3 5200-6500 54.5 150
70 2.9-3.1 ≤3200 63.5 150
70 3.2±0.1 3400-4500 62 150
76 3.4-3.8 ≤4500 68.1 150
89 3.9-4.3 ≤4500 80 150
99 4.4-4.8 ≤4500 89.7 150

Lintlha tsa tekheniki:

RUNAU Electronics e fana ka matla a semiconductor chips ea rectifier diode le welding diode.
1. Ho theoha ha matla a tlase ho boemo bo tlase
2. Metallization ea khauta e tla sebelisoa ho ntlafatsa thepa ea conductive le mocheso oa mocheso.
3. Mesa ea tšireletso ea lera le habeli

Malebela:

1. E le hore e lule e sebetsa hantle, chip e tla bolokoa boemong ba nitrogen kapa vacuum ho thibela phetoho ea motlakase e bakoang ke oxidation le mongobo oa likotoana tsa molybdenum.
2. Boloka sebaka sa chip se hloekile, ka kopo roala liatlana 'me u se ke ua ama chip ka matsoho a sa roala letho.
3. Sebetsa ka hloko ha u ntse u sebelisa.U se ke ua senya bokaholimo ba resin ea chip le lera la aluminium sebakeng sa palo ea heke le cathode.
4. Ha ho etsoa liteko kapa ho kenyelletsa, ka kopo hlokomela hore ho tšoana, ho bata le ho qobella matla a ho koala mochine o tlameha ho lumellana le litekanyetso tse boletsoeng.Ho se tšoane ho hotle ho tla fella ka khatello e sa lekaneng le tšenyo ea chip ka matla.Haeba ho behiloe matla a mangata, chip e tla senyeha habonolo.Haeba clamp force e behiloeng e le nyane haholo, ho se kopane le mocheso ho tla ama ts'ebeliso.
5. Thibelo ea khatello e amanang le sebaka sa cathode ea chip e tlameha ho tlosoa

Khothalletsa Clamp Force

Boholo ba Chips Keletso ea Clamp Force
(KN) + 10%
Φ25.4 4
Φ30 kapa Φ30.48 10
Φ35 13
Φ38 kapa Φ40 15
Φ50.8 24
Φ55 26
Φ60 28
Φ63.5 30
Φ70 32
Φ76 35
Φ85 45
Φ99 65

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona