Thyristor Chip
Thyristor Chip
The thyristor chip e entsoeng ke RUNAU Electronics e qalile ho hlahisoa ke GE processing standard le thekenoloji e lumellanang le maemo a kopo ea USA mme e tšoaneleha ke bareki ba lefats'e ka bophara.E hlahisoa ka litšoaneleho tse matla tsa ho hanyetsa mokhathala oa mocheso, bophelo bo bolelele ba ts'ebeletso, motlakase o phahameng, hona joale, matla a ho ikamahanya le maemo a tikoloho, joalo-joalo. bokgoni bo ile ba ntlafatswa haholo.
Paramethara:
| Diameter mm | Botenya mm | Palo ea li-volts V | Heke Dia. mm | Cathode Inner Dia. mm | Cathode Out Dia. mm | Tjm ℃ |
| 25.4 | 1.5±0.1 | ≤2000 | 2.5 | 5.6 | 20.3 | 125 |
| 25.4 | 1.6-1.8 | 2200-3500 | 2.6 | 5.6 | 15.9 | 125 |
| 29.72 | 2±0.1 | ≤2000 | 3.3 | 7.7 | 24.5 | 125 |
| 32 | 2±0.1 | ≤2000 | 3.3 | 7.7 | 26.1 | 125 |
| 35 | 2±0.1 | ≤2000 | 3.8 | 7.6 | 29.1 | 125 |
| 35 | 2.1-2.4 | 2200-4200 | 3.8 | 7.6 | 24.9 | 125 |
| 38.1 | 2±0.1 | ≤2000 | 3.3 | 7.7 | 32.8 | 125 |
| 40 | 2±0.1 | ≤2000 | 3.3 | 7.7 | 33.9 | 125 |
| 40 | 2.1-2.4 | 2200-4200 | 3.5 | 8.1 | 30.7 | 125 |
| 45 | 2.3±0.1 | ≤2000 | 3.6 | 8.8 | 37.9 | 125 |
| 50.8 | 2.5±0.1 | ≤2000 | 3.6 | 8.8 | 43.3 | 125 |
| 50.8 | 2.6-2.9 | 2200-4200 | 3.8 | 8.6 | 41.5 | 125 |
| 50.8 | 2.6-2.8 | 2600-3500 | 3.3 | 7 | 41.5 | 125 |
| 55 | 2.5±0.1 | ≤2000 | 3.3 | 8.8 | 47.3 | 125 |
| 55 | 2.5-2.9 | ≤4200 | 3.8 | 8.6 | 45.7 | 125 |
| 60 | 2.6-3.0 | ≤4200 | 3.8 | 8.6 | 49.8 | 125 |
| 63.5 | 2.7-3.1 | ≤4200 | 3.8 | 8.6 | 53.4 | 125 |
| 70 | 3.0-3.4 | ≤4200 | 5.2 | 10.1 | 59.9 | 125 |
| 76 | 3.5-4.1 | ≤4800 | 5.2 | 10.1 | 65.1 | 125 |
| 89 | 4-4.4 | ≤4200 | 5.2 | 10.1 | 77.7 | 125 |
| 99 | 4.5-4.8 | ≤3500 | 5.2 | 10.1 | 87.7 | 125 |
Lintlha tsa tekheniki:
RUNAU Electronics e fana ka matla a semiconductor chips ea phase controlled thyristor le fast switch thyristor.
1. Ho theoha ha matla a tlase ho boemo bo tlase
2. Botenya ba lera la aluminium bo feta 10 microns
3. Mesa ea tšireletso ea lera le habeli
Malebela:
1. E le hore e lule e sebetsa hantle, chip e tla bolokoa boemong ba nitrogen kapa vacuum ho thibela phetoho ea motlakase e bakoang ke oxidation le mongobo oa likotoana tsa molybdenum.
2. Boloka sebaka sa chip se hloekile, ka kopo roala liatlana 'me u se ke ua ama chip ka matsoho a sa roala letho.
3. Sebetsa ka hloko ha u ntse u sebelisa.U se ke ua senya bokaholimo ba resin ea chip le lera la aluminium sebakeng sa palo ea heke le cathode.
4. Ha ho etsoa liteko kapa ho kenyelletsa, ka kopo hlokomela hore ho tšoana, ho bata le ho qobella matla a ho koala mochine o tlameha ho lumellana le litekanyetso tse boletsoeng.Ho se tšoane ho hotle ho tla fella ka khatello e sa lekaneng le tšenyo ea chip ka matla.Haeba ho behiloe matla a mangata, chip e tla senyeha habonolo.Haeba clamp force e behiloeng e le nyane haholo, ho se kopane le mocheso ho tla ama ts'ebeliso.
5. Thibelo ea khatello e amanang le sebaka sa cathode ea chip e tlameha ho tlosoa
Khothalletsa Clamp Force
| Boholo ba Chips | Keletso ea Clamp Force |
| (KN) + 10% | |
| Φ25.4 | 4 |
| Φ30 kapa Φ30.48 | 10 |
| Φ35 | 13 |
| Φ38 kapa Φ40 | 15 |
| Φ50.8 | 24 |
| Φ55 | 26 |
| Φ60 | 28 |
| Φ63.5 | 30 |
| Φ70 | 32 |
| Φ76 | 35 |
| Φ85 | 45 |
| Φ99 | 65 |